Stacking signal TSV for thermal dissipation in global routing for 3D IC.

Po-Yang Hsu Hsien-Te Chen TingTing Hwang

Published in: ASP-DAC (2013)

Keyphrases

global information
heat transfer
integrated circuit
non stationary
infrared
high frequency
routing protocol
ad hoc networks
routing algorithm
face recognition
shortest path
frequency domain
routing problem
combining multiple
wireless ad hoc networks
signal detection