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Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling.
Michele Calabretta
Alessandro Sitta
Salvatore Massimo Oliveri
Gaetano Sequenzia
Published in:
IEEE Access (2021)
Keyphrases
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low cost
high speed
high density
power consumption
real time
control algorithm
power dissipation
infrared
high bandwidth
cmos technology
chip design
host computer
power electronics