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Thermal-Aware Modeling and Analysis for a Power Distribution Network Including Through-Silicon-Vias in 3-D ICs.

Weijun ZhuGang DongYintang Yang
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2019)
Keyphrases
  • distribution network
  • machine learning
  • genetic algorithm
  • infrared
  • power consumption
  • high density
  • neural network
  • control system
  • computational intelligence