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MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture.

Raja SwaminathanMichael J. SchulteBrett WilkersonGabriel H. LohAlan SmithNorman James
Published in: VLSI Technology and Circuits (2023)
Keyphrases
  • mutual information
  • management system
  • high speed
  • machine learning
  • design process
  • layered architecture
  • real time
  • website
  • case study
  • multi dimensional
  • parallel implementation