The coming of CSP: automated assembly processes for high-volume chip scale packaging.

Fei-Yue Wang Ming-Kuan Liu

Published in: IEEE Robotics Autom. Mag. (2004)

Keyphrases

high volume
high density
high speed
constraint satisfaction problems
big data
real time
low cost
printed circuit boards
constraint propagation
decomposition methods
scale space
multi agent
constraint satisfaction
data center
np complete
np hard
real world
data sets