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Dependence of process parameters on planarization isolation and etching of sloped vias in polyimides for GaAs ICs.

J. K. SinghA. RoybardhanH. S. KothariB. R. SinghW. S. Khokle
Published in: Proc. IEEE (1987)
Keyphrases
  • integrated circuit
  • real time
  • computer vision
  • bayesian networks
  • maximum likelihood
  • input parameters
  • data sets
  • information systems
  • feature selection
  • multiscale
  • parameter estimation
  • sensitivity analysis
  • fine tuned