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Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.

Yao YaoLeon M. Keer
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • numerical analysis
  • mechanical properties
  • image enhancement
  • high speed
  • finite difference
  • image registration
  • neural network
  • multiscale
  • simulated annealing
  • x ray
  • high density