Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity.
Yuyang WangSongli WangRobert ParsonsAsher NovickVignesh GopalKaylx JangAnthony RizzoChia-Pin ChiuKaveh HosseiniTim Tri HoangSergey Y. ShumarayevKeren BergmanPublished in: CICC (2024)
Keyphrases
- high bandwidth
- energy efficient
- high density
- high speed
- low latency
- end to end
- wireless sensor networks
- energy consumption
- sensor networks
- low bandwidth
- data center
- energy efficiency
- application specific
- base station
- low cost
- fiber optic
- gigabit ethernet
- data collection
- mobile terminals
- ibm eservertm
- real time
- wireless networks
- parallel architectures
- data processing