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Laser ReSeal - Combination of Accelerometer and Gyroscope Sensors in a Single MEMS Chip Silicon Wafer Processing Technology for Six Degrees of Freedom in Inertial Sensors.

Holger RumpfJens FreyKurt-Ulrich RitzauAchim BreitlingPeter StaffeldMawuli Ametowobla
Published in: IEEE SENSORS (2020)
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