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Defect and microstructural evolution in thermally cycled Cu through-silicon vias.
James Marro
Chukwudi Okoro
Yaw S. Obeng
Kathleen A. Richardson
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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high density
infrared
integrated circuit
high speed
data aggregation
temporal evolution
real time
thin film
artificial life
mechanical properties