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Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal.

Naoya WatanabeMasahiro AoyagiDaisuke KatagawaTsubasa BandohTakahiko MitsuiEiichi Yamamoto
Published in: 3DIC (2014)
Keyphrases
  • small number
  • information systems
  • neural network
  • real time
  • feature selection
  • e learning
  • case study
  • data structure
  • artificial neural networks
  • process control
  • mechanical properties