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Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit.

Yeji LeeWonyeong JangKyungbae KwonJihun ParkChanghyun YooJeesoo ChangJongwook Jeon
Published in: IEEE Access (2022)
Keyphrases
  • path finding
  • design process
  • power dissipation
  • data mining
  • genetic algorithm
  • user interface
  • high speed
  • nm technology
  • real time
  • dynamic programming
  • path planning