A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging.
ZhengJia WangYuhui WangZhouping YinPublished in: ICIRA (2) (2008)
Keyphrases
- high density
- fine tuning
- optimization problems
- parameter optimization
- global optimization
- highly non linear
- parameter space
- maximum likelihood
- optimization algorithm
- optimization method
- optimization process
- high speed
- parameter values
- artificial intelligence
- real time
- evolutionary algorithm
- parameter settings
- anisotropic diffusion
- constrained optimization
- computer science
- objective function
- image sequences
- physical models