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Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices.
Morihiro Kada
Published in:
3DIC (2009)
Keyphrases
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high density
integrated circuit
rapid development
case study
cost effective
communication technologies
data processing
st century
high bandwidth
low cost
personal computer
metal oxide semiconductor
database
mobile devices
data sources
data center