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Mechanism and thermal effect of delamination in light-emitting diode packages.

Jianzheng HuLianqiao YangMoo Whan Shin
Published in: Microelectron. J. (2007)
Keyphrases
  • light emitting
  • light emitting diodes
  • solder ball connect
  • infrared
  • light intensity
  • data sets
  • neural network
  • computational model
  • selection mechanism
  • mechanism design
  • visible spectrum