Future on-chip interconnect metallization and electromigration.

C.-K. Hu James J. Kelly Huai Huang Koji Motoyama Hosadurga Shobha Y. Ostrovski J. H.-C. Chen Raghuveer Patlolla Brown Peethala Praneet Adusumilli Terry A. Spooner Roger Quon L. M. Gignac Chris M. Breslin G. Lian M. Ali Jacob Benedict X. S. Lin S. Smith V. Kamineni X. Zhang Frank Wilhelm Mont S. Siddiqui Frieder H. Baumann

Published in: IRPS (2018)

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