Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits.
Chang-Lee ChenD.-R. YostJeffrey M. KnechtDavid C. ChapmanDouglas C. OakleyLeonard J. MahoneyJoseph P. DonnellyAntonio M. SoaresVyshnavi SuntharalingamRobert BergerV. BolkhovskyW. HuBruce D. WheelerCraig L. KeastDavid C. ShaverPublished in: 3DIC (2009)