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A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability.
R. Aggarwal
L. Jiang
S. Patra
N. Lajo
E. Kabir
R. Kasim
Published in:
IRPS (2022)
Keyphrases
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hot spots
low cost
high speed
high density
human computer interaction
single chip
real time
data sets
machine learning
information extraction
cluster analysis
key factors
physical design