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Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs.

Chao-Hung LuHung-Ming ChenChien-Nan Jimmy LiuWen-Yu Shih
Published in: Integr. (2013)
Keyphrases
  • single chip
  • low power
  • low cost
  • highly parallel
  • embedded processors
  • power consumption
  • image sensor
  • high quality
  • digital images
  • cmos image sensor
  • signal processor