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Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging.

Jongwoo ParkJohn Osenbach
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • software aging
  • databases
  • mobile devices
  • early stage
  • multimedia
  • information systems
  • power consumption
  • personal computer
  • processing capabilities
  • application server
  • age estimation
  • reliability assessment