Login / Signup
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging.
Jongwoo Park
John Osenbach
Published in:
Microelectron. Reliab. (2006)
Keyphrases
</>
software aging
databases
mobile devices
early stage
multimedia
information systems
power consumption
personal computer
processing capabilities
application server
age estimation
reliability assessment