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Void control during plating process and thermal annealing of through-mask electroplated copper interconnects.

Chunsheng ZhuWenguo NingHeng LiTao ZhengGaowei XuLe Luo
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • control system
  • process control
  • control charts
  • human errors
  • data sets
  • control method
  • raw material
  • real time
  • fuzzy logic
  • design process
  • optimal control
  • thin film
  • fiber optic