Login / Signup

Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package.

Ghanshyam NayakP. R. Mukund
Published in: VLSI Design (2004)
Keyphrases
  • high speed
  • low cost
  • cmos technology
  • analog vlsi
  • high density
  • power consumption
  • embedded systems
  • low power
  • circuit design
  • software package
  • real time
  • single chip