C
search
search
reviewers
reviewers
feeds
feeds
assignments
assignments
settings
logout
Prospects of 3D inductors on through silicon vias processes for 3D ICs.
Yiorgos I. Bontzios
Michael G. Dimopoulos
Alkis A. Hatzopoulos
Published in:
VLSI-SoC (2011)
Keyphrases
</>
high density
low cost
high speed
artificial intelligence
computational model
real world
machine learning
integrated circuit