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Chip-to-Chip Bondwire Output to an MZM PIC.

Horst HettrichMichael Möller
Published in: IEEE J. Solid State Circuits (2016)
Keyphrases
  • high density
  • low cost
  • high speed
  • physical design
  • analog vlsi
  • vlsi implementation
  • single chip
  • vlsi design
  • neural network
  • information systems
  • artificial intelligence
  • multithreading
  • cmos technology