Time-Series Forecast-Based Endpoint Thickness Compensation for Thinning of Sapphire Wafer.
Yu-Kun LinBing-Fei WuPublished in: IEEE Access (2023)
Keyphrases
- exponential smoothing
- box jenkins
- forecasting accuracy
- chaotic time series
- endpoints
- thinning algorithm
- short term
- arima model
- demand forecasting
- semiconductor manufacturing
- integrated circuit
- phase space reconstruction
- forecasting model
- edge detection
- early warning
- subsequence matching
- massively parallel
- multivariate time series
- mackey glass
- autoregressive
- medial axis
- dynamic time warping
- support vector regression
- neural network
- non stationary
- preprocessing
- moving average
- stock market
- binary images
- parallel thinning
- topology preservation
- phase space
- topology preserving
- cross section
- data mining tasks
- distance transform