Thermal-aware logic block placement for 3D FPGAs considering lateral heat dissipation (abstract only).
Juinn-Dar HuangYa-Shih HuangMi-Yu HsuHan-Yuan ChangPublished in: FPGA (2012)
Keyphrases
- heat transfer
- numerical simulations
- thermal conductivity
- propositional dynamic logic
- logic programming
- modal logic
- air conditioning
- finite element method
- higher level
- asynchronous circuits
- proof theory
- hardware software
- high level
- predicate logic
- numerical solution
- classical logic
- multi valued
- hardware implementation
- mathematical models
- finite element
- infrared
- high speed
- face recognition