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Characterization of adhesive wafer bonded CMUTs realized from BCB based sealed cavity.

Rayyan ManwarSazzadur Chowdhury
Published in: ISCAS (2016)
Keyphrases
  • semiconductor manufacturing
  • integrated circuit
  • data sets
  • case study
  • neural network
  • genetic algorithm
  • information systems
  • multiscale
  • object recognition
  • viewpoint
  • manufacturing process
  • axiomatic characterization