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3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology.

Anshuman BhuyanJung Woo ChoeByung-chul LeeIra O. WygantAmin NikoozadehÖmer OralkanButrus T. Khuri-Yakub
Published in: ISSCC (2013)
Keyphrases
  • ultrasound imaging
  • programmable logic
  • ultrasound images
  • high speed
  • three dimensional
  • focal plane
  • imaging systems
  • computer vision
  • maximum likelihood
  • parallel processing
  • range data
  • magnetic resonance images