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Extending the fatigue life of Pb-free SAC solder joints under thermal cycling.

Shoho IshikawaHironori TohmyohSatoshi WatanabeTomonori NishimuraYoshikatsu Nakano
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • global optimization
  • infrared
  • neural network
  • daily life
  • finite element analysis
  • thermal images
  • multiscale
  • real time
  • data sets
  • constraint satisfaction
  • arc consistency
  • solder ball connect