3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link.
Makoto SaenKenichi OsadaYasuyuki OkumaKiichi NiitsuYasuhisa ShimazakiYasufumi SugimoriYoshinori KohamaKazutaka KasugaItaru NonomuraNaohiko IrieToshihiro HattoriAtsushi HasegawaTadahiro KurodaPublished in: IEEE J. Solid State Circuits (2010)
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