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Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling.

Zhenyu WangJingbo SunA. Alper GoksoySumit K. MandalJae-Sun SeoChaitali ChakrabartiÜmit Y. OgrasVidya A. ChhabriaYu Cao
Published in: ASICON (2023)
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