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Accurate Modeling Method for Cu Interconnect.

Kenta YamadaHiroshi KitaharaYoshihiko AsaiHideo SakamotoNorio OkadaMakoto YasudaNoriaki OdaMichio SakuraiMasayuki HiroiToshiyuki TakewakiSadayuki OhnishiManabu IguchiHiroyasu MindaMieko Suzuki
Published in: IEICE Trans. Electron. (2008)
Keyphrases
  • modeling method
  • hybrid genetic
  • high speed
  • fuzzy neural network
  • artificial intelligence
  • pattern recognition
  • electron microscopy