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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.

Jai-Ming LinWei-Yi ChangHao-Yuan HsiehYa-Ting ShyuYeong-Jar ChangJuin-Ming Lu
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2021)
Keyphrases
  • infrared
  • mixed initiative
  • data sets
  • case study
  • decision support
  • building blocks
  • fixed number
  • stochastic domains