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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC.
Jai-Ming Lin
Wei-Yi Chang
Hao-Yuan Hsieh
Ya-Ting Shyu
Yeong-Jar Chang
Juin-Ming Lu
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2021)
Keyphrases
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infrared
mixed initiative
data sets
case study
decision support
building blocks
fixed number
stochastic domains