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A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration.

Jie LiaoBo JiaoJinshan ZhangShiwei LiuHao JiangJun TaoWenning JiangQi LiuLihua ZhangHaozhe ZhuChixiao Chen
Published in: ISCAS (2023)
Keyphrases
  • high speed
  • real time
  • data integration
  • knowledge base
  • bayesian networks
  • multi agent
  • data model
  • integrity constraints
  • information integration
  • consistent query answering