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Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles.
A. E. Hammad
A. A. Ibrahiem
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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mechanical properties
electron microscopy
thin film
stainless steel
finite element model
material properties
small sized
x ray
data mining
finite element
multi layer
real time
real world
multi objective
swarm optimization