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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors.
Serguei Stoukatch
Jean-François Fagnard
François Dupont
Philippe Laurent
Marc Debliquy
Jean-Michel Redouté
Published in:
IEEE Access (2022)
Keyphrases
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metal oxide
low cost
high speed
thermal conductivity
x ray
solid state
real time
genetic algorithm
low cost sensors
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numerical simulations
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