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Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress.
Jun Eon An
Usung Park
Dong Geon Jung
Chihyun Park
Seong-Ho Kong
Published in:
Sensors (2019)
Keyphrases
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high speed
high density
complex structures
infrared
neural network
case study
design process
tree structure
steady state
graph structure