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A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.
Chunsheng Zhu
Heng Li
Gaowei Xu
Le Luo
Published in:
Microelectron. Reliab. (2015)
Keyphrases
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high speed
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design process
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computer vision
information systems
case study
learning environment
expert systems
mobile robot
software engineering
structural information
structural properties