Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications.
Alvin J. JosephJohn D. GillisMark DohertyPeter J. LindgrenRosemary A. Previti-KellyRamana M. MalladiPing-Chuan WangMete ErturkHanyi DingEphrem G. GebreselasieMichael J. McPartlinJames S. DunnPublished in: IBM J. Res. Dev. (2008)
Keyphrases
- wireless communication
- high density
- high power
- thin film
- wireless networks
- wireless systems
- short range
- communication networks
- solar cell
- wireless communication systems
- computer simulation
- mobile communication
- ofdm system
- communication technologies
- data center
- wireless channels
- wifi
- wireless sensor networks
- fourth generation
- power consumption
- mobile computing
- wireless transmission
- wireless technologies
- chance discovery
- physical layer
- long range
- high speed
- low cost