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Test Cost Analysis for 3D Die-to-Wafer Stacking.

Mottaqiallah TaouilSaid HamdiouiKees BeenakkerErik Jan Marinissen
Published in: Asian Test Symposium (2010)
Keyphrases
  • high cost
  • databases
  • neural network
  • data mining
  • information retrieval
  • image sequences
  • training data
  • image analysis
  • quantitative analysis
  • integrated circuit
  • massively parallel