Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs.

Xiongfei Liao Jun Zhou Xin Liu

Published in: 3DIC (2011)

Keyphrases

high density
high speed
low cost
analog vlsi
genetic algorithm
single chip
physical design
high bandwidth
real time
artificial intelligence
input output
low power
vlsi implementation
host computer