A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package.
Mu-Shan LinChien-Chun TsaiKenny Cheng-Hsiang HsiehWen-Hung HuangYu-Chi ChenShu-Chun YangChin-Ming FuHao-Jie ZhanJinn-Yeh ChienShao-Yu LiY.-H. ChenC.-C. KuoShih-Peng TaiKazuyoshi YamadaPublished in: Hot Chips Symposium (2016)