Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects.
Woojin JinYungseon EoWilliam R. EisenstadtJongin ShimPublished in: IEEE Trans. Very Large Scale Integr. Syst. (2001)
Keyphrases
- three dimensional
- high speed
- power dissipation
- input output
- signal processing
- vlsi design
- image sequences
- surface reconstruction
- power consumption
- data mining
- low power
- x ray
- high accuracy
- multiresolution
- image processing
- human body
- range images
- high frequency
- expert systems
- pattern recognition
- neural network
- chip design
- unit length