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An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging.
Lanxiang Xiao
Lei Chen
Fengwei An
Published in:
IEEE Trans. Circuits Syst. II Express Briefs (2023)
Keyphrases
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high density
high speed
heat flow
cmos image sensor
image sensor
sensor data
low cost
sensor networks
real time
data acquisition
electrical power
dynamic range
low power
feedback loop
single chip
multi sensor
video camera
mechanical design
analog vlsi
concept drift
error accumulation
energy consumption