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TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs.
Daehyun Kim
Saibal Mukhopadhyay
Sung Kyu Lim
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2014)
Keyphrases
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power consumption
power dissipation
low power
power management
energy efficiency
power saving
energy saving
battery life
high speed
energy management
water level
image processing
signal processing
data center
prediction model
end to end delay