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Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications.

Cristina LopezLiang ChaiAziz ShaikhVern Stygar
Published in: Microelectron. Reliab. (2004)
Keyphrases
  • wire bonding
  • database
  • stress response
  • machine learning
  • learning algorithm
  • artificial intelligence
  • multi agent
  • image analysis
  • shape from shading