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Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering.
Geng Ma
Xiaoqing Huang
Shihao Liu
Published in:
IEEE Access (2021)
Keyphrases
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heat transfer
integrated circuit
numerical simulations
heat exchanger
temperature field
fluid flow
thermal conductivity
optimization problems
electron beam
flow rate
mathematical models
finite element method
computational fluid dynamics
natural gas
computational model
mathematical model