Login / Signup
Polymer-Based 3-D Printed 140-220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly.
Sang-Hee Shin
Xiaobang Shang
Nick M. Ridler
Stepan Lucyszyn
Published in:
IEEE Access (2021)
Keyphrases
</>
low cost
printed circuit boards
building blocks
low power
assembly process
high speed
data acquisition
integrated circuit
font recognition