Sang-Hee Shin

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 9

Top Topics

Assembly Process

Top Venues

IEEE Trans. Instrum. Meas.

Publications

Manoj Stanley, Martin J. Salter, Jonas Urbonas, James Skinner, Sang-Hee Shin, Sebastian De Graaf, Nick M. Ridler
Characterizing S-Parameters of Microwave Coaxial Devices With up to Four Ports at Temperatures of 3 K and Above for Quantum Computing Applications. IEEE Trans. Instrum. Meas. 73 (2024)
Liyan Zhu, Sang-Hee Shin, Roshan Payapulli, Ian W. Rossuck, Norbert Klein, Nick M. Ridler, Stepan Lucyszyn
3-D Printed THz Waveguide Components. IEEE Access 11 (2023)
Roshan Payapulli, Liyan Zhu, Sang-Hee Shin, Manoj Stanley, Nick M. Ridler, Stepan Lucyszyn
Polymer-Based 3-D Printed 140 to 220 GHz Metal Waveguide Thru Lines, Twist and Filters. IEEE Access 11 (2023)
Sang-Hee Shin, Roshan Payapulli, Liyan Zhu, Manoj Stanley, Xiaobang Shang, Nick M. Ridler, Stepan Lucyszyn
3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems. IEEE Access 10 (2022)
Liyan Zhu, Roshan Payapulli, Sang-Hee Shin, Manoj Stanley, Nick M. Ridler, Stepan Lucyszyn
3-D Printing Quantization Predistortion Applied to Sub-THz Chained-Function Filters. IEEE Access 10 (2022)
Enrique Marquez-Segura, Sang-Hee Shin, Attique Dawood, Nick M. Ridler, Stepan Lucyszyn
Microwave Characterization of Conductive PLA and Its Application to a 12 to 18 GHz 3-D Printed Rotary Vane Attenuator. IEEE Access 9 (2021)
Sang-Hee Shin, Xiaobang Shang, Nick M. Ridler, Stepan Lucyszyn
Polymer-Based 3-D Printed 140-220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly. IEEE Access 9 (2021)
Sang-Hee Shin, Stepan Lucyszyn
Benchmarking a Commercial (Sub-)THz Focal Plane Array Against a Custom-Built Millimeter-Wave Single-Pixel Camera. IEEE Access 8 (2020)
Sang-Hee Shin, Diyar F. Alyasiri, Mario D'Auria, William J. Otter, Connor W. Myant, Daniel Stokes, Zhengrong Tian, Nick M. Ridler, Stepan Lucyszyn
Polymer-Based 3-D Printed Ku-Band Steerable Phased-Array Antenna Subsystem. IEEE Access 7 (2019)