Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint.

Lijuan Liu Wei Zhou Hongbo Zhang Baoling Li Ping Wu

Published in: Microelectron. Reliab. (2010)

Keyphrases

mechanical properties
electron microscopy
business intelligence
finite element model
database
neural network
machine learning
learning algorithm
image segmentation
data structure